polyimide films造句
例句与造句
- mica tapes-polyimide film-backed mica paper tapes
云母带.聚酰亚胺薄膜粉云母带 - adhesive coated polyimide film for flexible printed circuits
挠性印制电路用涂胶聚酰亚胺薄膜 - evaluation of polyimide film developing level in china
我国聚酰亚胺薄膜制造技术发展水平的评估 - copper-clad laminates for flexible printed wiring boards polyester film, polyimide film
柔性印制电路板用包铜层压板 - the effect on thermal stability of polyimide films based on phthalimide end-capped odpa and oda
聚酰亚胺薄膜热稳定性的影响 - It's difficult to find polyimide films in a sentence. 用polyimide films造句挺难的
- studies of the structural conversion and property change of polyimide film during the carbonization
膜碳化过程中结构和性能变化研究 - the dopping effect of nano-inorganic on structure and dielectric properties of polyimide films
无机纳米掺杂对聚酰亚胺薄膜的结构和介电性能影响 - measuring the relative dielectric constant of dupont 100hn and 100cr polyimide film under optical frequency
两种聚酰亚胺薄膜光频相对介电常数的测定 - base material for printed circuits-specifications-flexible copper-clad polyimide film, general purpose grade
印制电路板基材.第2部分:规范.第13节:通用柔性覆铜聚酰亚胺膜 - thermal expand coefficient of polyimide films at each temperature was measured in the process of thermal cycling
摘要测量了聚酰亚胺薄膜在冷热循环过程中各温度点的热膨胀系数。 - base materials or printed circuits . part 2 : specifications . speciication no 13 : flexible copper-clad polyimide film, general purpose grade
印刷电路用基材.第2部分:规范.13号规范:一般用途级包铜软聚酰亚胺薄膜 - base materials for printed circuits; part 2 : specifications; specification no . 13 : flexible copper-clad polyimide film, general purpose grade
印制电路用基材.第2部分:规范.第13号规范:通用级软覆铜聚酰亚胺薄膜,通用级 - base materials for printed circuits . part 2 : specifications . specification no . 15 : flexible copper-clad polyimide films of defined flammability
印制电路用基材.第2部分:规范.第15号规范:规定的易燃性的软覆铜聚酰亚胺薄膜 - specification for plastic films for electrical purposes-specifications for individual materials-requirements for polyimide films used for electrical insulation
电工用塑料薄膜规范.各型材料规范.电绝缘用聚酰亚胺薄膜要求 - specifications for pressure-sensitive adhesive tapes for electrical purposes-specifications for individual materials-polyimide film tapes with pressure-sensitive adhesive
电气用压敏胶带规范.单个材料规范.带压敏胶粘剂的聚酰亚胺膜带
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